Tiled electronic device having a plurality of display panels and a flexible substrate

ABSTRACT

A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.62/685,286, filed on Jun. 15, 2018, the entirety of which isincorporated by reference herein. This Application claims priority ofChina Patent Application No. 201811431648.9 filed on Nov. 27, 2018, theentirety of which is incorporated by reference herein.

BACKGROUND Field of the Invention

The present disclosure relates to a tiled electronic device, and inparticular to a tiled electronic device with a narrow frame.

Description of the Related Art

In recent years, display screens have been widely used to dynamicallydisplay advertisements. However, due to the size limitations of anoperable display screen, it is difficult to display an advertisementover a large area using a single display screen.

In order to solve the above problem, in the prior art, a plurality ofdisplay screens are connected into one screen wall to display large-areaadvertisements. However, the display area of the display panel cannotcover the entire area of the display panel, and thus a frame is formedon the edge of the display panel. When the display panel is spliced, theimage displayed on the screen wall will appear as a grid-like line,which affects the quality of the integral image of the screen wall.

Accordingly, while existing display panels have been generally adequatefor their intended purposes, they have not been entirely satisfactory inall respects. Consequently, it would be desirable to provide a solutionfor improving the display panels.

BRIEF SUMMARY

A tiled electronic device includes a plurality of display panels, and atleast one of the display panels includes a flexible substrate, a pixel,and two signal wires. The flexible substrate has a display portion and abent portion connected to the display portion. The pixel is disposed onthe display portion. The signal wires are disposed on the flexiblesubstrate, and electrically connected to the pixel. Each of the signalwires has a first segment disposed on the display portion, and a secondsegment disposed on the bent portion. The two first sections have afirst pitch, and the two second sections have a second pitch. The firstpitch is different from the second pitch.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 is a schematic view of the tiled electronic device in accordancewith a first embodiment of the present disclosure.

FIG. 2 is a top view of the display panel in accordance with the firstembodiment of the present disclosure, wherein the flexible substrate isin an unfolded state.

FIG. 3 is a side view of the display panel in accordance with the firstembodiment of the present disclosure, wherein the flexible substrate isin a bent state.

FIG. 4 is a top view of the display panel in accordance with a secondembodiment of the present disclosure.

FIG. 5 is a side view of the display panel in accordance with the secondembodiment of the present disclosure.

FIG. 6 is a side view of the second segment and the bent portion inaccordance with some embodiments of the present disclosure.

FIG. 7A is a top view of the second segment of the signal wire inaccordance with the first embodiment of the present disclosure.

FIG. 7B is a top view of the second segment of the signal wire inaccordance with the second embodiment of the disclosure.

FIG. 7C is a top view of the second segment of the signal wire inaccordance with a third embodiment of the present disclosure.

FIG. 7D is a top view of the second segment of the signal wire inaccordance with a fourth embodiment of the present disclosure.

FIG. 7E is a top view of the second segment of the signal wire inaccordance with a fifth embodiment of the present disclosure.

FIG. 7F is a top view of the second segment of the signal wire inaccordance with a sixth embodiment of the present disclosure.

FIG. 7G is a top view of the second segment of the signal wire inaccordance with a seventh embodiment of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the present disclosure.Specific examples of components and arrangements are described below tosimplify the present disclosure. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact.

In addition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

The words, such as “first” or “second”, in the specification are for thepurpose of clarity of description only, and are not relative to theclaims or meant to limit the scope of the claims. In addition, termssuch as “first feature” and “second feature” do not indicate the same ordifferent features.

Spatially relative terms, such as upper and lower, may be used hereinfor ease of description to describe one element or feature'srelationship to other elements or features as illustrated in thefigures. The spatially relative terms are intended to encompassdifferent orientations of the device in use or operation in addition tothe orientation depicted in the figures. Moreover, the shape, size,thickness, and tilt angle depicted in the drawings may not be drawn toscale or may be simplified for clarity of discussion; these drawings aremerely intended for illustration.

In the present disclosure, the term “electrically connected to”includes, unless otherwise defined, a direct connection, an indirectconnection, and an electrical coupling.

In the present disclosure, the term “substantially” means the variationof the absolute value of the distance between the two is less than 10%.

In the present disclosure, the description “substantially parallel toeach other” means that the absolute difference between the angles of thetwo is less than the variation within 5 degrees.

In the present disclosure, the descriptions, such as “disposed on”,indicate the corresponding positional relationship between two elements,and the two elements may be in direct contact or there may be otherlayers between the two components instead of direct contact.

FIG. 1 is a schematic view of the tiled electronic device A1 inaccordance with a first embodiment of the present disclosure. The tiledelectronic device A1 includes display panels 1. The display panel 1 maybe an organic light-emitting diode (OLED) panel, a quantum dot panel, amini LED panel or a micro LED panel structure, or a tiled panelassembled by different or the same type of the panel structures, butthere are not limited there to. In the embodiment, the display panel 1may be a LED panel. The display panel 1 may be arranged in an array on aplane. Each display panel 1 is configured to display an image. All theimages displayed by display panels 1 can be spliced into an integralimage.

In the embodiment, the tiled electronic device A1 has four displaypanels 1. However, the number of display panels 1 may be at least two,and the number of display panel 1 is not limited. In some embodiments,the number of display panel 1 may exceed 100. The size of the displaypanel 1 is greater than or equal to 5 inch and less than or equal to 100inch, but it is not limited thereto.

In the embodiment, the sizes and the shapes of the display panels 1 maybe the same. In some embodiments, the sizes and/or the shapes of thedisplay panels 1 may be different. In the embodiment, the shapes of thedisplay panel 1 may be rectangular. In some embodiments, the displaypanel 1 may be a polygon or an irregular shape. The polygon may be atriangle, a quadrilateral, a pentagon, a hexagon, or any suitable shape,but it is not limited thereto.

The display panel 1 includes pixels 10. The pixels 10 may be arranged inan array on a plane. Each pixel 10 is configured to display differentcolors. All pixels 10 may present an image. In the embodiment, theshapes of the pixels 10 may be the same. In the embodiment, the shape ofthe pixel 10 may be a square, a rectangle or an irregular shape, but itis not limited thereto. In one embodiment, each pixel 10 is disposed ona flexible substrate 20, and includes at least one light-unit electrode11 and a common electrode (VSS) 12. The described embodiment is only anexample and is not limited thereto.

For the purpose of clarity, there are 24 pixels 10 in one display panels1. However, the number of pixels 10 is not limited. In some embodiments,the number of pixels 10 is in a range from 10,000 to 50,000. In someembodiments, the number of pixels 10 may exceed one 1,000 or 10,000.

In order to enable the integral image displayed by the tiled electronicdevice A1 to have a better image quality, the distance d11 between anytwo centers of adjacent pixels 10 arranged in an extension direction D1are substantially the same. In one embodiment, if the pixel 10 includesthree light-unit electrodes 11 and one common electrode 12. Theconnection lines, which are connected the geometric centers of thelight-unit electrodes 11 and the geometric center of the commonelectrode 12, may form a polygonal area or an irregular area. Thegeometric center of the area formed by the connecting lines is definedas a pixel center.

The pixel 10 may include only one light-unit electrode 11 or only onecommon electrode 12. In another embodiment, if the pixel 10 includesonly one light-unit electrode 11 and one common electrode 12, theconnection line, which is connected the geometric center of thelight-unit electrode 11 and the geometric center of the common electrode12, has a center point. The center point is the pixel center.

The pixel 10 may not include the light-unit electrode 11 or may notinclude the common electrode 12. The described embodiment is only anexample and is not limited thereto. The pixel 10 may include one singlelight-unit electrode 11 or include one single common electrode 12. Thegeometric center of the light-unit electrode 11 itself or the geometriccenter of the common electrode 12 itself is the pixel center. Moreover,in two adjacent display panels 1, the distance d12 between any two pixelcenters of adjacent pixels 10 arranged in the extension direction D1 aresubstantially the same as the distance d11. Moreover, in one displaypanel 1, the distances d13 between any two pixel centers of adjacentpixels 10 arranged in an extension direction D2 are substantially thesame. In one embodiment, the extension direction D2 may be perpendicularto the extension direction D1.

Moreover, in two adjacent display panels 1, the distances d14 betweenany two centers of adjacent pixels 10 arranged in the extensiondirection D2 are substantially the same as the distances d13. In theembodiment, the distances d11 and d12 are substantially the same as thedistances d13 and d14 respectively. In some embodiments, the distancesd11 and d12 are substantially different than the distances d13 and d14respectively.

Accordingly, in the tiled electronic device A1 of the presentdisclosure, the pixels 10 may be filled with each display panel 1. Eachdisplay panel 1 may has a narrow frame F1. The integral image displayedby the tiled electronic device A1 can present a narrow boundary line,thereby improving the quality of the integral image.

In the embodiment, the light-unit electrodes 11 may be electricallyconnected to an electrode of LED (such as an anode or a cathode). Thecommon electrodes 12 may be an electrically connected to the otherelectrode of LED (such as a cathode or an anode). After applying drivingvoltage or constant voltage to the light-unit electrodes 11 or thecommon electrodes 12, the light-emitting diode (LED) after the packagingprocess (not shown in figures) may be emitted with a specific color,such as red light, green light, white light or blue light, with aspecific brightness. The pixels 10 may present in different colors orbrightness by controlling the voltage of the different light-unitelectrodes 11 or the voltage of the common electrode 12 in the pixel 10.

In one embodiment, the material of the flexible substrate 20 may bepolyimide (PI), polyethylene terephthalate (PET) or another materialthat is suitable for use as a flexible substrate. The describedembodiment is only an example and is not limited thereto.

The light-unit electrodes 11 and the common electrodes 12 may bearranged in an array in the pixel 10. In some embodiments, the pixel 10may not include the common electrodes 12, and the common electrodes 12are disposed on the opposite side of the flexible substrate 20, so as toform a vertical type of LED structure. In addition, the light-unitelectrodes 11 are arranged in an array in the pixel 10.

In the embodiment, each pixel 10 includes three light-unit electrodes 11and one common electrode 12. However, the number of light-unitelectrodes 11 is not limited thereto. There may be at least onelight-unit electrode 11. In some embodiments, there may be four, five,or six light-unit electrodes 11. In other embodiments, the light-unitelectrodes 11 have different sizes or shapes. It depends on therequirements of the color balance of the display panel or the emissionlayer of LEDs use the different luminescent materials having differentlifetime.

For example, if the lifetime of the blue luminescent material is lessthan the lifetime of the red or green luminescent material, the size ofthe blue light-unit electrode may be larger than the size of the red orgreen light-unit electrode. The described embodiment is only an exampleand is not limited thereto.

In one embodiment, the arrangement of the light-unit electrodes 11 andthe light-emitting regions of the light-emitting diodes (LEDs), whichwas performed after the packaging process (not shown in figures), may bedifferent in the top view of the display panel 1. For example, the threelight-unit electrodes 11 of each pixel 10 are arranged in an array (asshown in FIG. 1). The LEDs with three different colors are arranged inthe extension direction D1 in sequence. The described embodiment is onlyan example and is not limited thereto.

FIG. 2 is a top view of the display panel 1 in accordance with the firstembodiment of the present disclosure, wherein the flexible substrate 20is in an unfolded state. FIG. 3 is a side view of the display panel 1 inaccordance with the first embodiment of the disclosure, wherein theflexible substrate 20 is in a bent state. The flexible substrate 20includes a display portion 21, a bent portion 22 and a circuit portion23.

In FIG. 2, after the circuit portion 23 of the flexible substrate 20 inthe unfolded state is bent relative to the display portion 21, theflexible substrate 20 is changed to the bent state as shown in FIG. 3.The flexible substrate 20 includes at least one bent portion 22 and/orat least one circuit portion 23. The number of bent portion 22 and/orcircuit portion 23 may be at least two. In the embodiment, the number ofbent portions 22 and/or circuit portions 23 is one. The describedembodiment is only an example and is not limited thereto.

The display portion 21 may substantially extend in a plane. In theembodiment, the display panel 1 may be rectangular. The pixel 10 may bearranged in an array on the display portion 21. In some embodiments, thedisplay portion 21 may be a polygon or an irregular shape. The polygonmay be a triangle, a quadrangle, or a pentagon.

As shown in FIG. 2 and FIG. 3, the edge of a portion of the pixel 10 isa portion of the edge of the display portion 21. Therefore, the displaypanel 1 of the present disclosure may be a display panel 1 with anarrower frame. When many display panels 1 are spliced into the tiledelectronic device A1 as shown in FIG. 1, the display panel 1 can have anarrow frame, which can improve the quality of the integral imagedisplayed by the tiled electronic device A1.

The bent portion 22 is connected to the display portion 21. In the bentstate, since the bent portion 22 is formed by bending the flexiblesubstrate 20, the bent portion 22 may be substantially curved. However,basically, the bent portion 22 may substantially extend in a bendingdirection D3. The bending direction D3 may be perpendicular to theextension direction D1 and the extension direction D2. In otherembodiments, the bending direction D3 may be the connection direction oftwo bending interfaces I1 and I2 from a side view.

The circuit portion 23 is connected to the bent portion 22. In otherwords, in the bent state, the circuit portion 23 is bent to the backside of the support plate 30, and substantially parallel to the displayportion 21. The circuit portion 23 may not necessarily in direct contactwith the support plate 30.

In the embodiment, the area of the bent portion 22 is less than the areaof the circuit portion 23, and the area of the circuit portion 23 isless than the area of the display portion 21. In some embodiments, thearea of the bent portion 22 is 20 times less than the area of thedisplay portion 21. The area of the bent portion 22 is 10 times lessthan the area of the circuit portion 23.

In the embodiment, a bending interface I1 is between the display portion21 and the bent portion 22. The bent portion 22 is bent relative to thedisplay portion 21 via the bending interface I1 (the first bendinginterface). Another bending interface (the second bending interface) I2is between the bent portion 22 and the circuit portion 23. The bentportion 22 is bent relative to the circuit portion 23 via the anotherbending interface I2. Moreover, the bending interface I1 may besubstantially parallel to the another bending interface I2. In otherwords, the bending interface I1 and the another bending interface I2 maybe substantially parallel to the extension direction D2, orperpendicular to the extension direction D1. In another embodiment, thebending direction D3 may be the connection direction of the bendinginterface I1 and the another bending interface I2 from a side view.

In the embodiment, two notches 222 are formed on the two opposite sidesof the bent portion 22 in the extension direction D2. The notches 222may be located between the bending interface I1 and the another bendinginterface I2. In some embodiments, the edge of the notch 222 may beconnected to the bending interface I1 and the another bending interfaceI2. In the embodiment, the notch 222 may make the bent portion 22 bendsmoothly relative to the display portion 21 and the circuit portion 23.

In order to make the distances d11, d12, d13 and d14 of the centers ofthe pixels 10 of each display panel 1 of the present disclosure are thesame. In the present disclosure, the pixels 10 includes pixels 10 a(second pixels) and another pixel 10 b (second pixel). The pixels 10 aare disposed on the display portion 21, and connected to the bendinginterface I1. The pixels 10 a may be arranged in the extension directionD2. In the present disclosure, some of the pixels 10 (other than thepixels 10 a) may be the another pixels 10 b. The another pixels 10 b maybe electrically connected to the pixels 10 a, and they may be distantfrom the bending interface I1. In other words, the pixels 10 a arelocated between the bending interface I1 and the another pixels 10 b.

The width W1 of the pixel 10 a is less than the width W2 of the anotherpixel 10 b. In some embodiments, the width W1 of the pixel 10 a is about1.17 mm. The width W2 of the another pixel 10 b is about 1.27 mm. Inother words, the difference between the width W2 of the another pixel 10b and the width W1 of pixel 10 a is about 0.1 mm. In some embodiments,the difference between the width W2 of the another pixel 10 b and thewidth W1 of pixel 10 a is in range from 0.05 mm to 0.3 mm. The widths W1and W2 may be measured in the extension direction D1.

In some embodiments, (as shown in FIG. 2 and FIG. 3), the bent portion22 is bent, and the bent surface of the bent portion 22 in the bendingdirection D3 has a top end 221. The top end 221 is close to the centerof the bent portion 22. In the extension direction D1, the distancebetween the top end 221 and the bending interface I1 (or the bendinginterface I2) plus the width W1 of the pixel 10 a may be substantiallythe same the width W2 of the another pixel 10 b. The describedembodiment is only an example and is not limited thereto. In anotherembodiment, the top end 221 may be closer to the bending interface I1than the center of the bent portion 22, depending on the designer'sdesign specifications for the frame F1 of the tiled electronic deviceA1.

As shown in FIGS. 2 and 3, in one embodiment, the display panel 1further includes a support plate 30, at least one control chips 40 and aflexible cable 50. In the bent state and in the bending direction D3,the support plate 30 is located between the display portion 21 and thecircuit portion 23, and connected to the display portion 21 and thecircuit portion 23 or at least one portion of the circuit portion 23. Insome embodiments, the support plate 30 may be a glass substrate or anopaque substrate, but it is not limited thereto. The support plate 30 isconfigured to improve the strength of the display panel 1. In someembodiments, the support plate 30 may be separated from the center areaof the bent portion 22 in the extension direction D1. That is to say,there is a gap between the central area of the bent portion 22 and thesupport plate 30 without a direct contact.

At least one control chips 40 are disposed on the circuit portion 23and/or the flexible cable 50, and are electrically connected to at leastone light-unit electrode 11 of the pixel 10. Each of the control chips40 may be a scan-driving chip, a guard-and-test chip, and/or adata-driving chip. The end of the flexible cable 50 is electricallyconnected to the circuit portion 23. As shown in FIG. 2 and FIG. 3, thecontrol chips 40 a may be scan-driving chips. The control chip 40 b maybe a guard-and-test chip. The control chip 40 c may be disposed on theflexible cable 50, and may be a data-driving chip. In one embodiment,the number of control chips 40 a may be greater than the number ofcontrol chips 40 b or control chips 40 c. However, the describedembodiment is only an example and is not limited thereto.

In the embodiment, in the extension direction D1, the control chips 40 aare close to the bent portion 22, and are arranged in the extensiondirection D2. The control chip 40 a is closer to the bent portion 22relative to the control chip 40 b, and extends in the extensiondirection D2. The control chip 40 c is far from the bent portion 22relative to the control chip 40 b, and extends in the extensiondirection D2.

FIG. 4 is a top view of the display panel 1 in accordance with a secondembodiment of the present disclosure. FIG. 5 is a side view of thedisplay panel 1 in accordance with the second embodiment of the presentdisclosure. The distance d3 between the top of the notch 222 and atleast end of the notch 222 is greater than or equal to 1.5 mm, and lessthan or equal to 3 mm. The distance d3 is measured in the extensiondirection D2. In some embodiments, the distance d3 is 1 to 5 times thewidth W1 or the width W2 of the pixel 10 (W1≤d3≤5*W1 or W2≤d3≤5*W2).

The width W3 of the bent portion 22 is greater than or equal to 0.5 mm,and less than or equal to 2 mm. The width W3 is measured in theextension direction D1 (as shown in FIG. 4). In some embodiments, thedistance between the bending interface I1 and the bending interface I2is substantially equal to the width W3. The width W3 is 1 to 5 times thewidth W1 of the pixel 10 (W1≤W3≤5*W1).

Moreover, in the pixel 10 a, the distance d4 between the bendinginterface I1 and the light-unit electrode 11 (adjacent to the bendinginterface I1) is greater than or equal to 50 μm, and less than or equalto 150 μm.

Each of the pixels 10 (the another pixels 10 b and the pixels 10 a) iselectrically connected to at least one transistor (TFT) 13. Thetransistors 13 are disposed on the display portion 21, and eachtransistor 13 is electrically connected to the light-unit electrode 11or the common electrode 12. The transistor 13 is configured to controlat least one or more light-unit electrodes 11 to enable or disable. Inone embodiment, the transistor 13 may be an amorphous thin-filmtransistor, low temperature polysilicon thin-film transistor, ametal-oxide thin-film transistor or a hybrid structure transistor (forexample, the low temperature polysilicon transistor is electricallyconnected to the metal-oxide transistor), but it is not limited thereto.

In the embodiment, the display panel 1 further includes signal wires S1(first signal wires), signal wires S2 (second signal wires), and signalwires S3 (third signal wires). The signal wires S1, the signal wire S2,and the signal wires S3 are disposed on the flexible substrate 20. Eachof the signal wires S1, the signal wires S2, and the signal wires S3 iselectrically connected to at least one or more transistors 13 and atleast one control chips 40 (as shown in FIG. 2).

The designs of the transistors 13, the signal wire S1, the signal wiresS2, and the signal wires S3 according to this embodiments may be appliedto the first embodiment.

In the embodiment, the signal wires S1, the signal wires S2 and thesignal wires S3 may be data signal wire, gate signal wires, commonsignal wires, ground signal wires or other types of signal wires. Thedescribed embodiment is only an example according to the requirements ofthe designer, and is not limited thereto. In one embodiment, the signalwires S1 are the signal wires S2 are electrically connected to thecontrol chip 40 c. The control chip 40 c may transmit data signals to atleast one transistors 13 via signal wires S1 and signal wires S2, andsignal wires S3 may be electrically connected to ground or commonpotential signals.

In some embodiments, the display panel 1 further includescompensation-signal wires and scan-signal wires (not shown in figures)disposed on the flexible substrate 20. The compensation-signal wires andthe scan-signal wires may be electrically connected to at least onecontrol chip 40 c (as shown in FIG. 2, one control chip 40 c are shownin FIG. 2, but it is not limited thereto). In the embodiment, thescan-signal wire may be electrically connected to the control chips 40a. The control chips 40 a may be transmit scan signals to the transistor13 via the scan-signal wire. The transistors 13 may control at least oneor more light-unit electrodes 11 to be enabled or disabled according todata signals and scan signals.

In the embodiment, the signal wires S1 are closer to the notch 222 andthe edge of the display portion 21 extending in the extension directionD1 than the signal wires S2. Each signal wire S1 includes a firstsegment S11, an inclined segment S12, a second segment S13, and acontrol segment S14. The first segment S11 is disposed on the displayportion 21, and selectively electrically connected to the pixels 10 (theanother pixels 10 b and the pixels 10 a) arranged in the extensiondirection D1.

In the embodiment, two adjacent first segments S11 extend in theextension direction D1, and substantially parallel to each other. Eachfirst segment S11 is electrically connected to one transistor 13. In onepixel 10, the pitch (first pitch) E11 of two adjacent first segments S11is greater than or equal to 200 μm, and less than or equal to 400 μm. Inthe embodiment, the pitch E11 of two adjacent first segments S11 isabout 300 μm. The pitch E11 may be measured in the extension directionD2. In some embodiments, the first segment S11 includes many metallayers overlaid on the display portion 21 in sequence, such as amolybdenum layer, an aluminum layer, and a molybdenum layer.

At least a portion of the inclined segment S12 is disposed on thedisplay portion 21, and connected to the first segment S11. The inclinedsegment S12 is inclined relative to the first segment S11 and the secondsegment S13, and adjacent to the bending interface I1 and the notch 222in the extension direction D1. The angle B1 between the inclined segmentS12 and the bending interface I1 is about 0 degrees to 45 degrees.Moreover, the two adjacent inclined segments S12 may be linearlyextended, and substantially parallel to each other.

In the embodiment, the length of each inclined segment S12 may becalculated by the length of the inclined segment S12 projected to theextension direction D2. The projection lengths of two adjacent inclinedsegments S12 are different. In another embodiment, in the top view ofthe flexible substrate 20, the inclined segment S12 is overlapped atleast portion of the light-unit electrode 11, the common electrode 12 orthe transistor 13. Different inclined segments S12 may have differentoverlapping areas, and different overlapping areas of differentpositions may be adjusted according to electrical requirements to reducethe influence of possible parasitic capacitance.

As shown in FIG. 5, a portion of the inclined segment S12 is locatedbetween the display portion 21 and the light-unit electrode 11 of thepixel 10 a in the bending direction D3. In the embodiment, the displaypanel 1 further includes a dielectric layer 60, disposed on the displayportion 21. There may be other layers between the dielectric layer 60and the flexible substrate 20, or between the inclined segment S12 andthe flexible substrate 20.

The light-unit electrode 11 and the first segment S11 are disposed onthe dielectric layer 60. The inclined segment S12 may be disposed on thedielectric layer 60. The dielectric layer 60 is optionally excluded, andthe inclined segment S12 is disposed on the display portion 21. In oneembodiment, the materials of the dielectric layer 60 comprise at leastorganic or inorganic materials. The organic materials may be SiOx, SiNx,or SiOxNy, and the inorganic materials may be PFA. The describedembodiment is only an example and is not limited thereto. The stackstructure is only an example and not limited thereto. For example, froma top view (such as in the bending direction D3), the stack sequence ofthe light-unit electrode 11, the first segment S11, the dielectric layer60, and the inclined segment S12 may be changed according torequirements.

The second segment S13 is disposed on the bent portion 22, and connectedto the inclined segment S12. The control segment S14 is disposed on thecircuit portion 23 (when the flexible substrate is in an unfoldedstate), and connected to the second segment S13 and electricallyconnected to control chip 40. In the bent state, the angle B2 betweenthe second segment S13 and the bending interface I1 is about 80 degreesto 135 degrees (please refer to FIG. 4 at the same time). When the bentportion 22 is bent in the bending direction D3, an arc angle B4 isbetween the bent portion 22 and the edge surface 31 of the support plate30, or the bent portion 22 is substantially perpendicular to the displayportion 21 or the circuit portion 23.

The arc angle B4 may be greater than or equal to 2 degrees, and lessthan or equal to 85 degrees. In one embodiment, the arc angle B4 may begreater than or equal to 2 degrees, and less than or equal to 45degrees. In another embodiment, the arc angle B4 is between a connectionline and an extension line, wherein the connection line is a lineconnecting the top end 221 of the bent portion 22, which is bent in thebending direction D3, and a bottom end I11 of the bending line I1 in thebending direction D3. Moreover, the extension line is a line of theextension of the edge surface 31 of the support plate 30 in the bendingdirection D3.

In another embodiment, the edge surface 31 of the support plate 30 maybe a rough surface, so the edge surface 31 of the support plate 30 maybe an average surface of the rough surface. In this disclosure, therough surface is averaged from a highest point and a lowest point of theextension direction D1. In the embodiment, two adjacent second segmentsS13 are substantially parallel to each other, and may extend to thedisplay portion 21 to connect with the inclined segment S12.

In the embodiment, as shown in FIG. 4, the pitch E12 between twoadjacent second segments S13 is greater than or equal to 10 μm, and lessthan or equal to 40 μm. In the embodiment, the pitch (second pitch) E12of two adjacent second segments S13 is about 25 μm. The pitch E12 may bemeasured in the extension direction D2. In other words, in one pixel 10,the pitch of two adjacent first segments S11 is greater than the pitchof two adjacent second segments S13. Moreover, in one pixel 10, thepitch of two adjacent first segments S11 may be greater than the pitchof two adjacent inclined segments S12.

In the embodiment, the signal wire S2 is far from the edge of thedisplay portion 21 than the signal wire S1 in the extension directionD2. Each signal wire S2 includes a first segment S21, a second segmentS23, and a control segment S24. The first segment S21 is disposed on thedisplay portion 21, and electrically connected to the pixels 10 (theanother pixels 10 b and the pixels 10 a) in the extension direction D1.In the embodiment, the pixels 10 a are disposed on the display portion21, and adjacent to the bending interface I1. The pixels 10 b is farfrom the edge of the display portion 21 than the pixels 10 a in theextension direction D1.

In the embodiment, the two adjacent first segments S21 extends in theextension direction D1, and substantially parallel to each other. Eachfirst segment S21 is electrically connected to at least one transistor13. In one pixel 10, the pitch E21 of two adjacent first segments S21 isin a range from 200 μm to 400 μm. In the embodiment, the pitch E21 oftwo adjacent first segments S21 is about 300 μm. The pitch E21 may bemeasured in the extension direction D2. In some embodiments, the firstsegment S21 comprises a molybdenum layer, an aluminum layer and amolybdenum layer disposed on the display portion 21 in sequence.Moreover, the first segment S21 may be substantially parallel to thefirst segment S11, and the pitch E21 is substantially equal to the pitchE11.

The second segment S23 is disposed on the bent portion 22, and connectedto the first segment S21. The control segment S24 is disposed on thecircuit portion 23, connected to the second segment S23 and electricallyconnected to the control chips 40. In the embodiment, two adjacentsecond segments S23 are substantially parallel to each other, andsubstantially parallel to the second segment S13. In the embodiment, thepitch E22 between two adjacent second segments S23 is between about 200μm and 400 μm. In the embodiment, the pitch E22 of two adjacent firstsegments S23 is about 300 μm. The pitch E22 may be substantially equalto the pitch E21 and the pitch E11. The pitch E22 may be measured in theextension direction D2.

FIG. 6 is a side view of the second segment S13 and the bent portion 22in accordance with some embodiments of the present disclosure. Thesecond segment S13 includes a first insulation layer L1, a first metallayer L2, a second metal layer L3, a third metal layer L4, and a secondinsulation layer L5. The first insulation layer L1 is disposed on thebent portion 22. The first metal layer L2 is disposed on the firstinsulation layer L1, and comprises at least one titanium material. Thesecond metal layer L3 is disposed on the first metal layer L2, andcomprises at least one aluminum material. The third metal layer L4 isdisposed on the second metal layer L3, and comprises at least onetitanium material. The second insulation layer L5 is disposed on thethird metal layer L4.

In some embodiments, the second segment S23 of signal wire S2 may havethe same structure and material as the second segment S13 of signal wireS1.

The signal wires S3 may be disposed on the display portion 21, the bentportion 22 and the circuit portion 23. The signal wires S3 on thedisplay portion 21 may be electrically connected to the commonelectrodes 12 of the pixels 10 arranged in the extension direction D1.In the embodiment, the structure of the signal wires S3 may be designedaccording to the signal wires S1 and the signal wires S2. The signalwires S3 may extend substantially parallel to the first segments S11,the second segments S13, the first segments S21 and the second segmentsS23.

FIG. 7A is a top view of the second segment S13 of the signal wire S1 inaccordance with the first embodiment of the present disclosure. As shownin FIG. 2, when the flexible substrate 20 is in an unfolded state, thesecond segment S13 may substantially extend in the extension directionD1. As shown in FIG. 3 and FIG. 7A, when the flexible substrate 20 is inbent state, at least portion of the second segment S13 may substantiallyextend in the bending direction D3.

The width W5 of the second segment S13 is greater than or equal to 10μm, and less than or equal to 15 μm. In the embodiment, the width W5 ofthe second segment S13 is about 12 μm. The width W5 is measured in theextension direction D2.

In the embodiment, at least portion of the second segment S13 maysubstantially extend in the bending direction D3. The signal wire S1further includes through holes S131. The through holes S131 may besubstantially and separately arranged in the bending direction D3.

As shown in FIG. 7A, in the embodiment, the through hole S131 may berectangular, but it is not limited thereto. In some embodiments, thethrough hole S131 may be a circle, oval, square, or an irregular shape.In some embodiments, the through hole S131 may be triangular,quadrilateral, pentagonal, or hexagonal.

In the embodiment, the distances between the geometric centers of thethrough holes S131 and the edges S133 of the second segments S13 may besubstantially the same. The distance d5 between two adjacent throughholes S131 may be greater than or equal to 4 μm, and less than or equalto 8 μm. In the embodiment, the distance d5 between two adjacent throughholes S131 is about 6 μm. The width W61 of the through hole S131 may begreater than or equal to 2 μm, and less than or equal to 6 μm. Thelength W62 of the through holes S131 may be greater than or equal to 3μm, and less than or equal to 12 μm. The width W61 may be measured inthe extension direction D2. The width W62 may be measured in the bendingdirection D3.

FIG. 7B is a top view of the second segment S13 of the signal wire S1 inaccordance with the second embodiment of the disclosure. In theembodiment, the orientations of the through holes S131 may be different.In the embodiment, each through hole S131 has a first orientation and asecond orientation. The angle between the extension direction of thethrough hole S131 in the first orientation and the bending direction D3is about positive 45 degrees. The angle between the extension directionof the through hole S131 in the second orientation and the bendingdirection D3 is about negative 45 degrees. The through hole S131 in thefirst orientation and the through hole S131 in the second orientationmay be substantially arranged in an alternate arrangement in the bendingdirection D3. However, the described embodiment is only an example andis not limited thereto. The angle can be changed according to therequirement of the user.

FIG. 7C is a top view of the second segment S13 of the signal wire S1 inaccordance with a third embodiment of the present disclosure. In theembodiment, the second segment S13 may be a wavy structure. The throughholes (first through holes and the second through holes) S131 and S132may be substantially arranged in a staggered arrangement in the bendingdirection D3.

In the embodiment, in the extension direction D2, the distances betweenthe through holes S131 and the edges S133 may be substantially the same.The distances between the through holes S132 and the edges S133 may bethe same. Moreover, the distances between the through holes S131 and theedges S133 are less than the distances between the through holes S132and the edges S133.

Each through hole S131 may be separated from at least one adjacentthrough hole S132 in the bending direction D3. The distance d5 betweenthe through hole S131 and the through hole S132 in the bending directionD3 may be greater than or equal to 2 μm, and less than or equal to 5 μm.In the embodiment, the through holes S131 and S132 are irregularlyshaped. The shapes of the through holes S131 and the through holes S132are substantially the same in a bending direction D3. In anotherembodiment, the shapes of the through holes S131 and the through holesS132 are substantially the same, that means the absolute difference ofthe areas of the through holes S131 and S132 are less than or equal to10%.

FIG. 7D is a top view of the second segment S13 of the signal wire S1 inaccordance with a fourth embodiment of the present disclosure. In theembodiment, the through holes S131 and S132 are substantially arrangedin a staggered arrangement in the bending direction D3. The throughholes S131 and S132 are formed on two opposite edges S133 of the secondsegment S13.

In the embodiment, the through holes S131 and S132 may be semicircularor any other shape. The described embodiment is only an example and isnot limited thereto. The diameters W63 of the through holes S131 andS132 are greater than or equal to 2 μm, and less than or equal to 5 μm.In the embodiment, the diameters W63 of the through holes S131 and S132are about 3 μm.

The through holes S131 are separated from the through holes S132 in thebending direction D3. The distance d5 between the through hole S131 andthe through hole S132 in the bending direction D3 may be greater than orequal to 2 μm, and less than or equal to 5 μm. The distance d6 betweentwo adjacent through holes S131 may be greater than or equal to 5 μm,and less than or equal to 8 μm. The distance d7 between two adjacentthrough holes S132 is greater than or equal to 5 μm, and less than orequal to 8 μm. In the embodiment, the distance d6 is substantially thesame as distance d7. In some embodiments, the distance d6 may besubstantially different than the distance d7.

FIG. 7E is a top view of the second segment S13 of the signal wire S1 inaccordance with a fifth embodiment of the present disclosure. The secondsegment S13 may extend substantially in bending direction D3. Thethrough holes S131 and S132 may substantially arranged in a staggeredarrangement in the bending direction D3.

In the embodiment, the through holes S131 and S132 are rectangle. Thethrough hole S131 is separated from the through hole S132 in the bendingdirection D3. The distance d5 between the through holes S131 and thethrough holes S132 in the bending direction D3 may be greater than orequal to 2 μm, and less than or equal to 5 μm. In the embodiment, in theextension direction D2, the distances between the through holes S131 andthe edges S133 are substantially the same. Moreover, the distancesbetween the through holes S132 and the edges S133 are substantially thesame. Moreover, the distance between one of the through holes S131 andthe edge S133 may be greater than the distance between one of thethrough holes S132 and the edge S133. In one embodiment, the distancebetween one of the through holes S131 and the edge S133 may be less thanthe distance between one of the through holes S132 and the edge S133(not shown in FIG. 7E).

FIG. 7F is a top view of the second segment S13 of the signal wire S1 inaccordance with a sixth embodiment of the present disclosure. In theembodiment, the through holes S131 may be semicircular, and the throughhole S132 may be rectangular, but it is not limited thereto. The shapeof the through holes S131 is different from the through holes S132. Thesecond segment S13 may extend substantially in the bending direction D3.The through holes S131 and S132 may be substantially arranged in astaggered arrangement in the bending direction D3.

The through holes S131 are formed on two opposite edges S133 of thesecond segment S13. The through holes S132 are located between theopposite edges S133 of the second segment S13. The through holes S131are separated from the through holes S132 in the bending direction D3.The distance d5 between the through hole S131 and the through hole S132in the bending direction D3 is greater than or equal to 1 μm, and lessthan or equal to 5 μm.

FIG. 7G is a top view of the second segment S13 of the signal wire S1 inaccordance with a seventh embodiment of the present disclosure. In theembodiment, the second segment S13 may extend substantially in thebending direction D3. The second segment S13 may be a grid structure.The through holes S131 are arranged on the second segment S13 in anarray. In the embodiment, the shape of the through holes S131 may be arhombus, a square, a circle, a rectangle, a polygon or any other shape.The shape of the through holes S131 may be modified according to theuser's requirements. The shape of the through holes S131 may be acceptedas long as the second segment S13 is bent along the bending directionD3, and the risk of disconnection can be mitigated and the advantage ofbeing easy to bend.

The disclosed features may be combined, modified, or replaced in anysuitable manner in one or more disclosed embodiments, but are notlimited to any particular embodiments.

In conclusion, the display panel of the present disclosure may utilize abent flexible substrate to make the elements, such as the control chips,to be disposed on the back side of the display panel, thereby reducingthe frame area of the display panel. Moreover, the notch is formed bythe bent portion of the flexible substrate so that the flexiblesubstrate can be smoothly bent. By changing the size of the pixel andthe extension path of the signal wire, the distances between the centersof any two adjacent pixels of adjacent display panels are the same,thereby improving the quality of the image displayed by the displaydevice.

While the present disclosure has been described by way of example and interms of preferred embodiment, it should be understood that the presentdisclosure is not limited thereto. On the contrary, it is intended tocover various modifications and similar arrangements (as would beapparent to those skilled in the art). Therefore, the scope of theappended claims should be accorded the broadest interpretation so as toencompass all such modifications and similar arrangements.

What is claimed is:
 1. A tiled electronic device, comprising: aplurality of display panels, wherein at least one of the display panelscomprises: a flexible substrate which comprises a display portion and abent portion connected to the display portion; a pixel disposed on thedisplay portion; two signal wires disposed on the flexible substrate,and electrically connected to the pixel, wherein each of the two signalwires has a first segment disposed on the display portion and a secondsegment disposed on the bent portion, wherein the two first segmentshave a first pitch, the two second segments have a second pitch, and thefirst pitch is different from the second pitch.
 2. The tiled electronicdevice as claimed in claim 1, wherein the first pitch is greater than orequal to 200 μm, and less than or equal to 400 μm, and the second pitchis greater than or equal to 10 μm, and less than or equal to 40 μm. 3.The tiled electronic device as claimed in claim 1, wherein an area ofthe bent portion is less than an area of the display portion.
 4. Thetiled electronic device as claimed in claim 1, wherein a bendinginterface is between the display portion and the bent portion, and anangle between at least one of the two second segments and the bendinginterface is greater than or equal to 80 degrees and less than or equalto 135 degrees.
 5. The tiled electronic device as claimed in claim 1,wherein a bending interface is between the display portion and the bentportion, the pixel further comprises a light-unit electrode adjacent tothe bending interface, wherein a portion of at least one of the twosignal wires is located between the bent portion and the light-unitelectrode.
 6. The tiled electronic device as claimed in claim 5, whereina distance between the light-unit electrode and the bending interface isgreater than or equal to 50 μm, and less than or equal to 150 μm.
 7. Thetiled electronic device as claimed in claim 1, wherein the bent portionhas a notch, a distance between a top and an end of the notch is greaterthan or equal to 1.5 mm and less than or equal to 3 mm.
 8. The tiledelectronic device as claimed in claim 1, wherein each of the two secondsegments comprises a first metal layer, a second metal layer disposed onthe first metal layer, and a third metal layer disposed on the secondmetal layer, wherein the first metal layer comprises at least onetitanium material or molybdenum material, the second metal layercomprises at least one aluminum material, and the third metal layercomprises at least one titanium material or molybdenum material.
 9. Thetiled electronic device as claimed in claim 1, wherein one of the twosecond segments extends in a bending direction, and the one of the twosecond segments comprises a plurality of through holes arranged in thebending direction.
 10. The tiled electronic device as claimed in claim1, wherein the flexible substrate further comprises a circuit portionconnected to the bent portion, and at least one control chip disposed onthe circuit portion.
 11. The tiled electronic device as claimed in claim10, wherein a bending interface is between the bent portion and thecircuit portion, and at least a portion of the bent portion is bentrelative to the circuit portion via the bending interface.
 12. The tiledelectronic device as claimed in claim 11, wherein another bendinginterface is between the display portion and the bent portion, and thebending interface is substantially parallel to the bending interface.13. The tiled electronic device as claimed in claim 12, wherein the bentportion has a notch that is connected to the bending interface and theanother bending interface, and that is formed on at least one side ofthe bent portion.
 14. The tiled electronic device as claimed in claim11, wherein the distance between the bending interface and the anotherbending interface is greater than or equal to 0.5 mm, and less than orequal to 2 mm.
 15. The tiled electronic device as claimed in claim 10,further comprising a support plate located between the display portionand the circuit portion, wherein the support plate is separated from acenter area of the bent portion.
 16. The tiled electronic device asclaimed in claim 10, wherein the at least one control chip comprises ascan-driving chip, a guard-and-test chip, or a data-driving chip. 17.The tiled electronic device as claimed in claim 1, further comprising ananother pixel disposed on the display portion, and electricallyconnected to the pixel, wherein a bending interface is between thedisplay portion and the bent portion, and the pixel is located betweenthe bending interface and the another pixel, and a width of the pixel isless than a width of the another pixel.
 18. The tiled electronic deviceas claimed in claim 17, wherein a difference between the width of theanother pixel and the width of the pixel is in range from 0.05 mm to 0.3mm.
 19. The tiled electronic device as claimed in claim 1, wherein eachof the two signal wires further has an inclined segment electricallyconnected to the first segment and the second segment, and the inclinedsegment is inclined relative to the first segment and the second segmentand disposed on the pixel.
 20. The tiled electronic device as claimed inclaim 1, wherein the first segments are parallel to each other, and thesecond segments are parallel to each other.